High Density Interconnect (HDI) PCB

Optimised for High Performance in Compact Spaces

HDI PCBs for next-Generation electronics

High-Density Interconnect boards offer compact designs with fine lines and microvias, perfect for advanced, and space-constrained applications.

Applications

Smartphones and tablets, wearable devices, medical devices, automotive electronics, networking and telecommunications, and high-end consumer electronics.

Capabilities

Layer Count

4 ~ 16 Layers

PCB Thickness

0.3mm ~ 3.2mm

Minimum Annual Ring

Via : 100µm
Laser Via : 50µm

Prepreg - Standard Glass Cloth

1027 / 1037 / 106 / 1080

Build Up Technology

2+N+2

Minimum Laser Drill Size

75µm

Via Type

Blind via , Buried via

Minimum Mechanical Drilled Size

0.15mm (150µm)

Minimum Target Pad

D + 100µm (D Laser Via)

Blind Via Aspect Ratio

≤ 1.0

Copper Thickness

1oz, 2oz, 3oz, 5oz

Maximum Dimple

10µm

Minimum Line Width / Spacing

75µm / 75µm

Solder Mask Registration

± 37.5µm

Minimum Solder Mask Bridge

Green/Red ± 75µm
Blue/Black ± 100µm

Maximum PCB Size

520mm X 620mm

Minimum PCB Size

16mm X 16mm

Surface Finishing

OSP, ENIG, Hard Gold,
HASL, Carbon, Peelable Mask, Selective Surface

Impedance Control Tolerance

± 10%

Special Capability

Non-wire Gold Finger, Hybird Material, Sequential Lamination

Explore GUH Full PCB Range

Multi-layer PCB

Custom Engineered PCB

Double-Sided PCB

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High Density Interconnect (HDI) PCB

Optimised for High Performance in Compact Spaces

HDI PCBs for next-Generation electronics

Applications

Capabilities

Explore GUH Full PCB Range

Multi-layer PCB

Custom Engineered PCB

Double-Sided PCB

Let’s Build Your PCB Solution

Have an enquiry?

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GUH Circuit Industry (PG) Sdn Bhd

A Subsidiary of GUH Holdings Berhad