Enhanced Performance for High-Density, High-Speed Systems

Multi-Layer PCBs for Complex Circuitry

Multi-Layer PCBs stack multiple conductive layers to support advanced designs, perfect for use in automotive, telecommunications, and industrial electronics.

Applications

5G communication devices, industrial automation equipment, medical imaging devices, networking equipment, graphic cards, control systems, and consumer electronics.

Capabilities

Layer Count
4 ~ 16 Layers
PCB Thickness
0.3mm ~ 3.2mm
Layer Registration
100µm
Minimum Mechanical Drill Size
0.15mm (150µm)
Hole Diameter Tolerance
PTH ± 50µm / NPTH ± 37.5µm
Drill Hole Accuracy
± 37.5µm
Plating Aspect Ratio
14 : 1
Copper Thickness
1oz , 2oz, 3oz, 5oz
Minimum Line Width / Spacing
75µm / 75µm
Solder Mask Registration
± 37.5µm
Minimum Solder Mask Bridge
Green/Red ± 75µm
Blue/Black ± 100µm
CNC Tolerance
± 100µm
CNC Process
• Hole to Edge
• Edge to Edge
• Circuit to Edge
CNS Process
± 0.25 mm
± 0.10 mm
± 0.10 mm
Maximum PCB Size
520mm X 620mm
Minimum PCB Size
16mm X 16mm
Surface Finishing
OSP, ENIG, Hard Gold,
HASL, Carbon, Peelable Mask,
Selective Surface
Impedance Control Tolerance
± 10%

Explore GUH Full PCB Range

High Density Interconnect (HDI)

Double-Sided PCB

Custom Engineered PCB

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